Based on the previous focus on hot runner injection molding scenarios where high-temperature tape can be used as a temporary fixation solution for suspended sensor probes, the core disadvantages of this method are as follows:
Limited Temperature Resistance: Ordinary polyimide high-temperature tape has a long-term temperature resistance of only 300℃. When the hot runner exceeds the temperature limit, the adhesive layer is prone to melting and delamination, causing the probe to become suspended again.
Insufficient Fixation Strength: The tape relies solely on adhesive force for positioning. Long-term exposure to high-temperature thermal vibration can lead to adhesive attenuation, increasing the risk of probe displacement.
Difficult Residue Cleaning: After the adhesive layer of the tape carbonizes at high temperatures, it leaves stubborn residue on the outer wall of the runner, requiring time-consuming and laborious cleaning.
Unsuitable for Long-Term Use: It can only serve as a temporary emergency solution for a few hours to a day, and cannot replace the long-term fixation effect of clips.
It is only suitable for short-term emergency use and cannot be used as a long-term fixation solution for probes.
