In the future, optically isolated measurement technology will evolve toward higher bandwidth, greater integration, intelligent processing, and miniaturization. Through the convergence of technologies such as silicon photonics chips, AI-driven signal recognition, and edge computing, it aims to achieve terahertz-level signal acquisition, automatic calibration, and remote diagnostic capabilities. This will meet the high-precision testing requirements of wide-bandgap devices-such as Silicon Carbide (SiC) and Gallium Nitride (GaN)-as well as new energy systems.
I. Performance Breakthroughs: Evolving Toward Higher Bandwidth and Greater Isolation
Exploration of Terahertz-Level Bandwidth
Currently, high-end optical isolation probes have achieved bandwidths exceeding 1 GHz; in the future, they will advance toward the terahertz (THz) level to meet the testing demands of 6G communications and ultra-high-speed digital circuits.
Specifically for GaN device testing, the optimal bandwidth requirement is ≥ 500 MHz; for SiC testing, it is ≥ 350 MHz. Higher bandwidth translates directly into more precise waveform reconstruction capabilities.
Ultra-High Isolation Voltage Capabilities
Optical isolation probes are capable of achieving isolation voltages exceeding 60 kV. This capability will be further enhanced in the future to accommodate extreme high-voltage environments, such as those found in High-Voltage Direct Current (HVDC) transmission systems and large-scale energy storage systems.
Crucially, the isolation capability depends on the insulation performance of the testing environment itself-rather than the probe-thereby offering an inherent safety advantage.
II. Technological Convergence: Silicon Photonics and AI-Driven Intelligence
Integration of Silicon Photonics Chips
The introduction of silicon photonics chips and miniaturized optical components reduces device size and enhances the stability of high-frequency signal acquisition, driving the evolution of probes toward greater miniaturization and modularity.
Empowerment via AI and Edge Computing
The next generation of probes will integrate AI signal processing modules to enable automatic recognition of anomalous waveforms, noise filtering, automatic calibration, and remote diagnostics, thereby boosting testing efficiency and overall intelligence levels.
Edge computing capabilities support real-time local analysis, reducing reliance on backend processing equipment.
III. Power Supply and Structural Optimization: Enhancing User Experience
Widespread Adoption of Laser Power Supply
The front-end of the probe is powered by a laser source located at the backend, enabling "seamless power delivery." This eliminates the need for battery charging and maintenance, thereby ensuring greater operational continuity.
Although the initial cost may be higher, this approach offers significantly greater convenience in terms of long-term operation and maintenance. Multi-Channel Synchronous Measurement
Supports the simultaneous acquisition of data from multiple optically isolated probes, facilitating the analysis of timing relationships among various signals within complex systems-such as the high-side and low-side gate drive signals in power inverters.
IV. Market Growth and Application Expansion
According to forecasts, the global market for high-voltage optically isolated probes is projected to reach approximately $28.5 million in 2024. This figure is expected to grow to $55.9 million by 2031, representing a Compound Annual Growth Rate (CAGR) of 9.0%.
This growth is driven by key industry trends, including the expansion of semiconductor manufacturing capacity and the increasing market penetration of new energy vehicles.
