Silicone-based and high-temperature chemical mold release agent are widely sprayed onto mold cavity surface during daily injection production for easy product demolding, improper over-spray and atomized floating release agent droplets diffuse around hot runner and gradually erode adjacent installed thermocouple sheath and outer insulation wire for all mainstream brand hot runner including Husky and domestic multi-cavity packaging mold. Fine atomized release agent mist suspended in air adheres to thermocouple probe surface after long-term accumulation and forms compact isolation film under continuous hot runner high-temperature baking, blocking effective heat exchange between sensing tip and hot runner metal matrix and inducing continuous measuring drift; silicone component inside release agent is difficult to decompose under normal hot runner working temperature, the solidified film cannot be cleaned easily by conventional wiping and needs sensor disassembly polishing treatment for precision recovery.
Organic solvent contained in chemical release agent volatilizes into corrosive vapor at high temperature and penetrates into unprotected ordinary insulation wire, making fiberglass coating swell, soften and peel off gradually; exposed bare core wire easily contacts mold metal to trigger short-circuit shutdown accident. Many operators spray release agent excessively for convenient demolding without blocking hot runner surrounding area, causing large-area release agent contamination of nearby thermocouple accessories in short production cycle.
Standard workshop operation uses baffle to shield hot runner and thermocouple position before release agent spraying to avoid floating mist attachment; select high-temperature low-volatility environmental release agent for hot runner intensive layout production line to reduce harmful volatile substance generation. Regular maintenance wipes probe and wire surface with special organic cleaning solvent to remove accumulated release agent residue periodically, effectively lowering drift failure rate induced by release agent contamination of hot runner thermocouple.
