Based on your previous focus on composite temperature sensors that directly contact the melt in hot runner scenarios, this technology is an optimized solution addressing the pain point of traditional temperature measurement lag:
Core Principle: A miniature temperature-sensing chip with a high thermal conductivity is pre-embedded inside the heat transfer block of the hot runner. Heat is rapidly conducted through a highly thermally conductive medium, responding to temperature changes within 0.3 seconds without direct contact with the melt.
Technical Advantages: It avoids the problems of direct-contact probes being easily worn down by the melt and prone to leakage, and its response speed is 5 times faster than traditional wall-mounted temperature sensors, with a temperature measurement accuracy of ±0.3℃.
Suitable Scenarios: Particularly suitable for scenarios with extremely high requirements for transient temperature changes, such as high-speed thin-wall injection molding and multi-color precision injection molding, accurately capturing minute fluctuations in melt temperature.
Maintenance Points: The temperature difference between the heat transfer block and the inside of the runner needs to be calibrated regularly to prevent temperature drift caused by aging of the thermal interface after long-term use.
This technology balances temperature response speed and reliability, significantly improving the temperature control stability of hot runners.
