Based on our previous discussion of the low-pass filtering effect and detection methods for distributed capacitance of hot runner conductors, the following targeted methods can be used to reduce the distributed capacitance of hot runner conductors:
Optimize conductor layout: Increase the spacing between the heating conductors and the metal flow channel plate, avoid dense parallel bundling of conductors, reduce the direct area of the conductors facing the housing, and directly reduce the amount of parasitic capacitance generated.
Use low-dielectric insulation conductors: Use low-dielectric-constant materials such as polytetrafluoroethylene (PTFE) as the conductor insulation layer, replacing conventional rubber insulation, reducing the distributed capacitance value at the material level.
Shorten the effective conductor length: While meeting installation requirements, shorten the total length of the hot runner heating conductors as much as possible, reducing the cumulative total of distributed capacitance at its source.
Use a special grounding method for the shielding layer: Ground the conductor shielding layer at one end to avoid forming additional capacitance loops and weaken the coupling effect of distributed capacitance.
These methods can significantly reduce distributed capacitance, weaken the low-pass filtering effect, avoid hot runner temperature overshoot caused by temperature control signal lag, and reduce the risk of thermal shock cracking.
